Facilities

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Staff in the Electronic-Photonic Integration Facility fabricate components, circuits, and subsystems for both internal and external partners.
MIT Lincoln Laboratory
The state-of-the-art facility supports the development of optoelectronic components, photonic integrated circuits, CMOS electronic integrated circuits, and hybrid electronic-photonic integration techniques.
The Microelectronics Laboratory covers 70,000 square feet.
MIT Lincoln Laboratory
The Microelectronics Laboratory is a state-of-the-art semiconductor research and fabrication facility that supports the design, fabrication, and packaging of novel devices.
A fused deposition modeling production system in the Rapid Hardware Integration Facility enables staff to build customized thermoplastic parts for prototype systems.
MIT Lincoln Laboratory
The expansive Rapid Hardware Integration Facility houses machines and equipment that enable Laboratory staff to build prototype systems within a short timeframe.

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