3D Cryogenic Packaging for Superconducting Computing

With advancements in electronics and digital technologies, effective thermal management has become a significant concern. Especially in applications requiring extreme cooling, such as cryogenics, conventional cooling approaches prove deficient. The functions of a cryogenic system often rely heavily on the efficient operation of its constituent components, thus requiring advanced cooling technologies. Traditional cooling methods struggle with uneven thermal distribution and limited cooling capacity, often leading to performance degradation and potential failure in high-performance computing and other intensive applications. Innovative solutions like the cryogenic electronic package are needed to effectively manage heat and enhance system performance.

Technology Description

The cryogenic electronic package consists of several key features, including a primary superconducting multi-chip module (SMCM), a secondary SMCM, a superconducting interposer, and a superconducting semiconductor structure. The assembly is arranged such that the interposer is overlaid and coupled with the primary SMCM. Then the secondary SMCM is mounted and connected to the superconducting interposer. The superconducting semiconductor structure, in turn, is placed over and attached to the secondary SMCM. Notably, the secondary SMCM and the aforementioned structure are both electrically coupled to the primary SMCM via the interposer. What sets this technology apart is the multilevel coupled superconducting system that allows effective heat dissipation and efficient electrical coupling. This unique structure enables advanced cooling technologies to enter realms of performance not possible with conventional strategies. Additionally, a method to fabricate this innovative cryogenic electronic package is proposed, further demonstrating its practical applicability and potential benefits.