Wideband and Radio Frequency Waveguide and Hybrid Integration in a Silicon Package

Circuit design and fabrication technologies have evolved over time to offer increased compactness, efficiency, and performance. As these circuits become more advanced, there is a need for improved shielding and structural support to ensure the circuits' durability and effective functioning, especially under varying conditions. Additionally, controlling circuit characteristics like impedance is crucial for the device's performance. Existing approaches may lack efficient techniques for providing mechanical support and impedance control in small-scale circuitry. Conventionally, the conductive paths or vias within the devices are often unsupported, vulnerable to physical disruptions that could impact the device's performance. Furthermore, the lack of control of impedance in transmission lines can lead to signal distortion, power loss, and overall unpredictability in the device's operation.

Technology Description

The technology detailed centers around a device that includes a wafer with a circuit component, marked by the presence of vias or channels. These vias are mechanically supported by a built-in post that is strategically positioned within a cavity in a cap wafer. In addition to being bonded to the device wafer, this cap wafer encompasses the circuit component, effectively shielding it. The unique aspect of this conception lies in the dependency of the transmission line's impedance on either the dimensions (width and height) of the cavity or the width of the center conductor within the cavity. Enabling specific control over the electrical characteristics of the device could potentially enhance performance and predictability of its operation.