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MMIP interns stand for a photo in the Lincoln Laboratory lobby.
In the Media

Massachusetts Microelectronics Internship Program: a big focus on critical tiny components

September 27, 2022
MIT EECS
Five small 3D-printed vessels of various colors (white, browns) and shapes (cups, pyramid shapes

New method 3D prints glass at low temperatures

September 19, 2022
a technician loads a reticle (a kind of optical blueprint) into the 193-nm lithography tool used in the sensor production process.
In the Media

How did black holes shape the cosmos? Fast, low-noise X-ray sensors may provide the answer

August 17, 2022
NASA Science
a photo of a 3d printer nozzle extriding material onto a piece of glass.

3D-printed shielding can help protect satellites from radiation damage

March 28, 2022
A design rendering of the Compound Semiconductor Laboratory – Microsystem Integration Facility at MIT Lincoln Laboratory.

Construction contract awarded for new semiconductor facility at MIT Lincoln Laboratory

January 28, 2022
This image shows the CMOS THz-ID chip.
In the Media

Reasserting U.S. leadership in microelectronics

January 19, 2022
MIT NEWS
A person with a protective gown and gloves holds a large wafer of integrated circuits. the wafer is vividly multicolored.
Awards

MIT Lincoln Laboratory wins nine R&D 100 Awards

November 2, 2021
an illustration; blue background, a green sphere on the right-hand side, and then yellow and blue lines leading to the orb, representing electronic waveforms.
In the Media

How the quantum systems accelerator set a shared direction in electronic controls for quantum computing

September 8, 2021
Quantum Systems Accelerator
3D drawing of a tunable coupler, which features two + figures plus a number of lines and graduated gauges
In the Media

Clearing the way toward robust quantum computing

June 21, 2021
MIT News
A prototype photonic integrated circuit.
In the Media

MIT spinoff building new solid-state lidar-on-a-chip system

December 1, 2020
IEEE Spectrum
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