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a photo of a 3d printer nozzle extriding material onto a piece of glass.

3D-printed shielding can help protect satellites from radiation damage

March 28, 2022
A design rendering of the Compound Semiconductor Laboratory – Microsystem Integration Facility at MIT Lincoln Laboratory.

Construction contract awarded for new semiconductor facility at MIT Lincoln Laboratory

January 28, 2022
This image shows the CMOS THz-ID chip.
In the Media

Reasserting U.S. leadership in microelectronics

January 19, 2022
MIT NEWS
A person with a protective gown and gloves holds a large wafer of integrated circuits. the wafer is vividly multicolored.
Awards

MIT Lincoln Laboratory wins nine R&D 100 Awards

November 2, 2021
an illustration; blue background, a green sphere on the right-hand side, and then yellow and blue lines leading to the orb, representing electronic waveforms.
In the Media

How the quantum systems accelerator set a shared direction in electronic controls for quantum computing

September 8, 2021
Quantum Systems Accelerator
3D drawing of a tunable coupler, which features two + figures plus a number of lines and graduated gauges
In the Media

Clearing the way toward robust quantum computing

June 21, 2021
MIT News
A prototype photonic integrated circuit.
In the Media

MIT spinoff building new solid-state lidar-on-a-chip system

December 1, 2020
IEEE Spectrum
A square electronic chip with a red laser hitting the side of it

Lighting up the ion trap

October 21, 2020
Department of Energy Article Header
In the Media

The Private Sector Unleashes Energy’s Potential

August 27, 2020
Energy.gov
A photo of a superconducting quantum hip with 16 qubits.

MIT partners with national labs on two new quantum research centers

August 26, 2020
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