The invention is an array backframe with integral manifolding designed for effectively cooling devices with high-performance fluid.

Technologies relating to high-performance computing and other electronic devices often face the problem of overheating due to constant power usage. It is crucial to maintain an optimum temperature to guarantee the operational lifetime and performance of these devices. Hence, there's a constant need for a more effective and efficient cooling system in this field. Traditional cooling systems have found it challenging to provide uniform cooling to all devices efficiently. They often struggle with controlling parasitic heat losses between fluid supply and exhaust channels. Moreover, the complexity of managing multiple fluid lines has always been a constraint, creating problems with system modularity and structural integrity.

Technology Description

This invention pertains to an array backframe with an integrated manifold system, specifically designed to effectively cool devices with high-performance fluid. The unique design of the array backframe conducts three fundamental operations. The first operation is to parallelize the fluid pathways, serving the purpose of supplying a uniform, cold fluid to every device in the array. The second feature is its ability to reduce parasitic heat losses between the supply and exhaust channels through the use of an isolation cavity. Lastly, this invention compacts hundreds of fluid lines into a single manifold, promoting system modularity while providing structural support. The invention stands out from other technologies due to its distinct ability to perform multiple tasks. Its method of evenly distributing cooling fluid to all devices, diminishing heat losses, and collapsing numerous fluid lines into a single internal manifold shows enhanced modularity and efficiency. Furthermore, it doubles as a structural support member, adding to its unique features.


  • Ensures uniform cooling for every device in the array
  • Minimizes parasitic heat losses between fluid channels
  • Collapses many fluid lines into a single internal manifold, enhancing modularity
  • Acts as a structural support member for the devices
  • Improves operational lifetime and performance of the devices

Potential Use Cases

  • High-performance computing systems for better cooling and overall performance
  • Electronic devices that require efficient temperature regulation, such as servers or mainframes
  • Telecommunication equipment that needs a consistent cool environment to function optimally
  • Scientific researching facilities that accommodate high-performing computational devices
  • Industrial machinery or equipment that generates a lot of heat