The technology is a 3D radiator unit cell with flat sides and a curf border, allowing for flexibility in array size, shape, and unit replaceability.

Traditional 3D radiator technologies have often struggled with limitations when it comes to adjusting their array size and shape, and doing so without affecting the unit cell spacing. The historically rigid designs restricted flexibility and adaptability in response to changing demands and conditions. Thus, there was an clear need for a technology that allows flexibility in the adjustment and modification of unit cell arrays. The major obstacle with incumbent technologies has been the lack of sufficient flexibility in array management. The inability to adjust array size and shape independently constrained enhancements and adaptability. Furthermore, retaining consistent unit cell spacing while introducing gaps between subarrays was a persistent technical challenge. As such, 3D radiator technologies that adhere to the conventional design principles failed to optimally meet certain operational needs, creating a demand for a more versatile solution.

Technology Description

The technology presents a new generation 3D radiator unit cell, distinguished by its flat-sided design. This particular geometry includes a uniquely incorporated curf border, made of sacrificial material. This border permits the determination of the size and shape of distinct subarrays. Further, it allows for a gap between said subarrays while maintaining continuous unit cell spacing. This aspect introduces greater flexibility to array size, shape, and line replaceable unit capabilities. What sets this technology apart is the flexibility it provides to array management. Traditional unit cell designs have often struggled with limitations in array adjustments. However, with the introduction of the sacrificial material component in the curf border, the technology enables independent customization of subarray size and shape. Furthermore, the retaining of contiguous unit cell spacing even when gaps are introduced between subarrays is a differential aspect, allowing for more flexible and adaptable unit shapes, sizes, and replacement capabilities.

Benefits

  • Enhances flexibility in array size and shape customization
  • Improves line replaceable unit capabilities
  • Enables gap introduction between subarrays while retaining unit cell spacing
  • Increases adaptability to changing operational needs
  • Overcomes limitations of traditional 3D radiator designs

Potential Use Cases

  • Advanced thermal management in aerospace systems
  • High-performance computing for efficient heat dissipation
  • Telecommunication infrastructure for optimal heat management
  • Electric vehicle batteries for thermal regulation
  • Industrial applications requiring customized heat-dissipation solutions