The technology is a lightweight antenna system, developed using foam material and plated metal and offering the functionality of traditional antennas at a reduced weight.

Traditional antennas, particularly in applications like ultrawideband array systems and space-based facilities, are known for their size, weight, and limited versatility. As these applications see a surge in demand, antennas are expected to be compact, lightweight, and adaptable in order to meet the evolving requisites. Therefore, there is an urgent need to reinvent antenna design and fabrication. Current antennas struggle to meet the requisites of compactness without impeding performance. The traditional approach usually involves bulky materials, resulting in heavy antennas that pose logistic and operational challenges, particularly in airborne or spaceborne systems. The lack of versatility in mounting options further restricts their usability across a variety of scenarios, underscoring the need for a lighter, more flexible solution.

Technology Description

This technology presents a unique way of crafting a lightweight antenna by using foam material that is strategically coated with a machinable material and later plated with metal. This method enables an effective radiator with dimensions and performance equivalent to traditional notch antennas but with significantly less weight. Mountable on a variety of substrates, embodiments of the technology can utilize mixed or multilayered foam substrates, including conventional printed circuit boards (PCBs), PCBs with sleeved coaxial vias, or foam substrates. What sets this technology apart is its response to the need for lightweight, versatile antennas, particularly in ultrawideband array systems and space-based applications. The incorporation of foam and metal-plated materials offers less weight without compromising performance, making it an ideal solution for applications for which weight comes at a premium. The invention's ability to be mounted on an array of substrates further enhances its flexibility and potential for widespread utilization.

Benefits

  • Significantly reduced weight without compromising on performance
  • Ability to be mounted on a variety of substrate types including conventional printed circuit boards
  • Flexibility to use mixed or multilayered foam substrates, allowing for application versatility
  • Applicability in broad-spectrum industries that require lightweight antennas
  • Increased feasibility for airborne or spaceborne applications because of reduced weight

Potential Use Cases

  • Use in ultrawideband array systems needing reduced weight
  • Employment in space-based applications requiring light weight and robust performance
  • Application in airborne systems
  • Use in various communication devices requiring lightweight, high-performance antennas
  • Utilization in remote sensing and surveillance systems requiring lightweight components