Electronic-Photonic Integration Facility
The Electronic-Photonic Integration Facility is used by internal and external partners to develop optoelectronic components and photonic integrated circuits (PICs), CMOS electronic integrated circuits, and hybrid electronic-photonic integrated subsystems for a variety of sensing, communication, and signal processing applications. The facility has internal capabilities for epitaxial-material growth, fabrication, packaging, and characterization of components and integrated subsystems.
Lincoln Laboratory staff who work in the facility help develop a range of technology solutions, including initial component specification and design, simulation and modeling, aggregation of designs for multiproject runs, and fabrication of prototype quantities of components, circuits, and subsystems.
For more information about the Electronic-Photonic Integration Facility and its capabilities, contact [email protected]du.