Air Dielectric Laminate Process Proposal for Printed Circuit Boards

Printed circuit boards (PCBs) serve as the structural foundation of electronic systems, with multiple components mounted onto these boards. However, the placement of certain components such as antennas and electromagnetic band gap materials has been a longstanding challenge. This is due to the effects of close physical proximity between these components and the PCB which can result in signal interference and suboptimal operation. Current approaches involve using fixed material spacers or mechanical standoff techniques to create distance between the PCB and the above elements. These techniques, however, often result in issues with consistency, increased complexity in assembly, and a lack of adaptability for a variety of configurations. Therefore, there's a need for an improved method that can generate precise, variable air gaps while simplifying the assembly process and offering greater flexibility.

Technology Description

The technology refers to an innovative process of creating a printed circuit board (PCB) assembly with one or more air gaps. This is achieved by utilizing a soluble material during the assembly process. The soluble material is compatible with conventional PCB fabrication procedures. Illustratively, different components can be bonded to the soluble material without any obstacle. Furthermore, the soluble substance is equipped to endure and resist the drilling operation. What sets this technology apart is its ability to introduce air gaps in the PCB. After the assembly of the PCB is finalized, the soluble material is dissolved, leaving behind an air gap where the soluble material formerly occupied space. This unique feature allows for novel configurations such as positioning an antenna, Electromagnetic Band Gap (EBG) material, or other electronic structures above the top surface of the PCB.