Craig Hill

Craig Hill is the process manager of the Microelectronics Laboratory, where he leads a team of process engineers in providing development, sustainment, and integration support for principal investigators. He and the process engineers support a variety of programs and technologies, including single-flux-quantum superconducting circuits, 90-nm complementary metal-oxide-semiconductor (CMOS), charge-coupled-device focal plane arrays, avalanche photodiode detector arrays, microfluidics, and gallium nitride on silicon (GaN on Si) devices.

Prior to joining Lincoln Laboratory, Hill was a senior principal semiconductor engineer at BAE Systems, where he focused on radiation-hardened electronics, silicon photonics, and reactive ion etch. His radiation-hardening work spanned multiple companies and was primarily for total ionizing dose and single event upset effects. He participated in the successful demonstration of a signal channelizer with silicon waveguides, germanium detectors, optical filters, and CMOS integrated onto the same silicon substrate. 

He has coauthored more than 10 patents and 10 publications, primarily in silicon photonic integration and devices. Previously, he worked in process development and manufacturing engineering for high-volume manufacturing of dynamic random-access memory, flash memory, and CMOS logic. His main emphasis was reactive ion etching, including gate conductor and Si deep trench etching. 

Hill holds an MS degree in engineering from Dartmouth College. His thesis was on the reduction of particle-related defects caused by a gate conductor reactive ion etch operation in a high-volume manufacturing process. Mr. Hill also holds a BS degree in electrical engineering from Brigham Young University.