Self-Healing Materials for Vibration Damping
New materials that are chemically inspired by nature could be tailored at the molecular level to dissipate vibrations in microsystems. Materials that can survive repeated external stresses could enable a next generation of enhanced microsystems.
A novel method for manufacturing interconnects could open the door for 3D-printed microelectronic systems.
Recent advances in imaging architectures and real-time processing are enabling the development of a miniature ladar sensor that can be deployed on a UAV.