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Development and application of spherically curved charge-coupled device imagers

April 1, 2015
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Journal Article
Author:
James A. Gregory
…
Published in:
Appl. Opt., Vol. 54, No. 10, 1 April 2015, pp. 3072-82.
Topic:
optics
R&D area:
R&D group:

Summary

Operation of a CCD imager on a curved focal surface offers advantages to flat focal planes, especially for lightweight, relatively simple optical systems. The first advantage is that the modulation transfer function can approach diffraction-limited performance for a spherical focal surface employed in large field-of-view or large-format imagers. The second advantage is that a curved focal surface maintains more uniform illumination as a function of radius from the field center. Examples of applications of curved imagers, described here, include a small compact imager and the large curved array used in the Space Surveillance Telescope. The operational characteristics and mechanical limits of an imager deformed to a 15 mm radius are also described.
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Summary

Operation of a CCD imager on a curved focal surface offers advantages to flat focal planes, especially for lightweight, relatively simple optical systems. The first advantage is that the modulation transfer function can approach diffraction-limited performance for a spherical focal surface employed in large field-of-view or large-format imagers. The second...

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Development and application of spherically curved charge-coupled device imagers

Hybridization process for back-illuminated silicon Geiger-mode avalanche photodiode arrays

April 5, 2010
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Conference Paper
Author:
Daniel R. Schuette
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Published in:
SPIE Vol. 7681, Advanced Photon Counting Techniques IV, 5 April 2010, 76810P.
Topic:
photonics
R&D area:
R&D group:

Summary

We present a unique hybridization process that permits high-performance back-illuminated silicon Geiger-mode avalanche photodiodes (GM-APDs) to be bonded to custom CMOS readout integrated circuits (ROICs) - a hybridization approach that enables independent optimization of the GM-APD arrays and the ROICs. The process includes oxide bonding of silicon GM-APD arrays to a transparent support substrate followed by indium bump bonding of this layer to a signal-processing ROIC. This hybrid detector approach can be used to fabricate imagers with high-fill-factor pixels and enhanced quantum efficiency in the near infrared as well as large-pixel-count, small-pixel-pitch arrays with pixel-level signal processing. In addition, the oxide bonding is compatible with high-temperature processing steps that can be used to lower dark current and improve optical response in the ultraviolet.
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Summary

We present a unique hybridization process that permits high-performance back-illuminated silicon Geiger-mode avalanche photodiodes (GM-APDs) to be bonded to custom CMOS readout integrated circuits (ROICs) - a hybridization approach that enables independent optimization of the GM-APD arrays and the ROICs. The process includes oxide bonding of silicon GM-APD arrays to...

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Hybridization process for back-illuminated silicon Geiger-mode avalanche photodiode arrays

Geiger-mode quad-cell array for adaptive optics

May 7, 2008
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Conference Paper
Author:
Brian F. Aull
…
Published in:
CLEO-QELS, 2008 Conf. on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conf., 4-9 May 2008.
Topic:
optics
R&D area:
R&D group:

Summary

We report an array of Shack-Hartmann wavefront sensors using high-fill-factor Geiger-mode avalanche detector quad cells hybridized to all-digital CMOS counting circuits. The absence of readout noise facilitates fast wavefront sensing at low light levels.
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Summary

We report an array of Shack-Hartmann wavefront sensors using high-fill-factor Geiger-mode avalanche detector quad cells hybridized to all-digital CMOS counting circuits. The absence of readout noise facilitates fast wavefront sensing at low light levels.

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Geiger-mode quad-cell array for adaptive optics

Orthogonal transfer arrays for wide-field adaptive imaging

June 7, 2007
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Conference Paper
Author:
Barry E. Burke
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Published in:
Proc. 2007 Int. Image Sensor Workshop, 7-10 June 2007.
Topic:
optics
R&D area:
R&D group:

Summary

The orthogonal transfer array (OTA) is a novel charge-coupled device (CCD) imager based on the orthogonal-transfer CCD (OTCCD). The OTCCD, in turn, is a device capable of charge transfer in all directions and has been developed for adaptive imaging in ground-based astronomy. By using a bright guide star as a beacon, the OTCCD can correct for wavefront tilt due to atmospheric effects as well as compensation for telescope shake, which in turn enhances the resolution and SNR. However, for wide field-of-view imaging the atmospheric wavefront distortions decorrelate over distances more than a few 10's of arcmin and hence an array of independently driven OTCCDs is required. To resolve this issue we developed the OTA, which consists of a two-dimensional array of OTCCDs combined with addressing and control logic to enable independent clocking of each OTCCD. This device enables spatially varying electronic tip-tilt correction and was developed for the Panoramic Survey Telescope and Rapid Response System (Pan-STARRS) program at the University of Hawaii Institute for Astronomy (UH/IfA)
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Summary

The orthogonal transfer array (OTA) is a novel charge-coupled device (CCD) imager based on the orthogonal-transfer CCD (OTCCD). The OTCCD, in turn, is a device capable of charge transfer in all directions and has been developed for adaptive imaging in ground-based astronomy. By using a bright guide star as a...

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Orthogonal transfer arrays for wide-field adaptive imaging

Lincoln Laboratory high-speed solid-state imager technology

September 17, 2006
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Conference Paper
Author:
Robert K. Reich
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Published in:
SPIE Vol. 6279, 27th Int. Congress on High-Speed Photography and Photonics, 17-22 September 2006, 62791K.
Topic:
optics
R&D area:
R&D group:

Summary

Massachusetts Institute of Technology, Lincoln Laboratory (MIT LL) has been developing both continuous and burst solid-state focal-plane-array technology for a variety of high-speed imaging applications. For continuous imaging, a 128 ¿ 128-pixel charge coupled device (CCD) has been fabricated with multiple output ports for operating rates greater than 10,000 frames per second with readout noise of less than 10 e- rms. An electronic shutter has been integrated into the pixels of the back-illuminated (BI) CCD imagers that give snapshot exposure times of less than 10 ns. For burst imaging, a 5 cm x 5 cm, 512 x 512-element, multi-frame CCD imager that collects four sequential image frames at megahertz rates has been developed for the Los Alamos National Laboratory Dual Axis Radiographic Hydrodynamic Test (DARHT) facility. To operate at fast frame rates with high sensitivity, the imager uses the same electronic shutter technology as the continuously framing 128 x 128 CCD imager. The design concept and test results are described for the burst-frame-rate imager. Also discussed is an evolving solid-state imager technology that has interesting characteristics for creating large-format x-ray detectors with ultra-short exposure times (100 to 300 ps). The detector will consist of CMOS readouts for high speed sampling (tens of picoseconds transistor switching times) that are bump bonded to deep-depletion silicon photodiodes. A 64 x 64-pixel CMOS test chip has been designed, fabricated and characterized to investigate the feasibility of making large-format detectors with short, simultaneous exposure times.
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Summary

Massachusetts Institute of Technology, Lincoln Laboratory (MIT LL) has been developing both continuous and burst solid-state focal-plane-array technology for a variety of high-speed imaging applications. For continuous imaging, a 128 ¿ 128-pixel charge coupled device (CCD) has been fabricated with multiple output ports for operating rates greater than 10,000 frames...

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Lincoln Laboratory high-speed solid-state imager technology

Laser radar imager based on 3D integration of Geiger-mode avalanche photodiodes with two SOI timing circuit layers

February 6, 2006
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Conference Paper
Author:
Brian F. Aull
…
Published in:
ISSCC 2006, IEEE Int. Solid-State Circuits Conf., 6-9 February 2006.
Topic:
ladar
R&D area:
R&D group:

Summary

We have developed focal-plane arrays and laser-radar (ladar) imaging systems based on Geiger-mode avalanche photodiodes (APDs) integrated with high-speed all-digital CMOS timing circuits. A Geiger-mode APD produces a digital pulse upon detection of a single photon. This pulse is used to stop a fast digital counter in the pixel circuit, thereby measuring photon arrival time. This "photon-to-digital conversion" yields quantum-limited sensitivity and noiseless readout, enabling high-performance ladar systems. Previously reported focal planes, based on bump bonding or epoxy bonding the APDs to foundry chips, had coarse (100um) pixel spacing and 0.5ns timing quantization.
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Summary

We have developed focal-plane arrays and laser-radar (ladar) imaging systems based on Geiger-mode avalanche photodiodes (APDs) integrated with high-speed all-digital CMOS timing circuits. A Geiger-mode APD produces a digital pulse upon detection of a single photon. This pulse is used to stop a fast digital counter in the pixel circuit...

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Laser radar imager based on 3D integration of Geiger-mode avalanche photodiodes with two SOI timing circuit layers

High-fill-factor, burst-frame-rate charge-coupled device

August 3, 2003
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Conference Paper
Author:
Robert K. Reich
…
Published in:
SPIE Vol. 5210, Ultrahigh- and High-Speed Photography, Photonics, and Videography, 3-8 August 2003, pp. 95-104.
Topic:
electronics
R&D area:
R&D group:

Summary

A 512x512-element, multi-frame charge-coupled device (CCD) has been developed for collecting four sequential image frames at megahertz rates. To operate at fast frame rates with high sensitivity, the imager uses an electronic shutter technology developed for back-illuminated CCDs. Device-level simulations were done to estimate the CCD collection well spaces for sub-microsecond photoelectron collection times. Also required for the high frame rates were process enhancements that included metal strapping of the polysilicon gate electrodes and a second metal layer. Tests on finished back-illuminated CCD imagers have demonstrated sequential multi-frame capture capability with integration intervals in the hundreds of nanoseconds range.
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Summary

A 512x512-element, multi-frame charge-coupled device (CCD) has been developed for collecting four sequential image frames at megahertz rates. To operate at fast frame rates with high sensitivity, the imager uses an electronic shutter technology developed for back-illuminated CCDs. Device-level simulations were done to estimate the CCD collection well spaces for...

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High-fill-factor, burst-frame-rate charge-coupled device

High-speed, electronically shuttered solid-state imager technology

July 8, 2002
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Conference Paper
Author:
Robert K. Reich
…
Published in:
Rev. Sci. Instrum. Vol. 74, No. 3, Pt. II, March 2003, pp. 2027-2031 (Proceedings of the 14th Topical Conference on High-Temperature Plasma Diagnostics, 8-11 July 2002)
Topic:
electronics
R&D area:
R&D group:

Summary

Electronically shuttered solid-state imagers are being developed for high-speed imaging applications. A 5 cmx5 cm, 512x512-element, multiframe charge-coupled device (CCD) imager has been fabricated for the Los Alamos National Laboratory DARHT facility that collects four sequential image frames at megahertz rates. To operate at fast frame rates with high sensitivity, the imager uses an electronic shutter technology designed for back-illuminated CCDs. The design concept and test results are described for the burst-frame-rate imager. Also discussed is an evolving solid-state imager technology that has interesting characteristics for creating large-format x-ray detectors with short integration times (100 ps to 1 ns). Proposed device architectures use CMOS technology for high speed sampling (tens of picoseconds transistor switching times). Techniques for parallel clock distribution, that triggers the sampling of x-ray photoelectrons, will be described that exploit features of CMOS technology.
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Summary

Electronically shuttered solid-state imagers are being developed for high-speed imaging applications. A 5 cmx5 cm, 512x512-element, multiframe charge-coupled device (CCD) imager has been fabricated for the Los Alamos National Laboratory DARHT facility that collects four sequential image frames at megahertz rates. To operate at fast frame rates with high sensitivity...

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High-speed, electronically shuttered solid-state imager technology

Broadband (200-1000 nm) back-illuminated ccd imagers

June 16, 2002
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Conference Paper
Author:
Barry E. Burke
…
Published in:
Scientific Detectors Workshop 2002, 16-22 June 2002.p. 41-50.
Topic:
optics
R&D area:
R&D group:

Summary

Improved and stable blue/UV quantum efficiency has been demonstrated on 2Kx4K imagers using molecular-beam epitaxy to create a thin doped layer on the back surface. Quantum efficiency data on thick (40-50 pm) imagers with single and dual-layer anti-reflection coatings is presented that demonstrates high and broadband response. Measurements of the optical point-spread response show the devices to be fully depleted with good response across a broad spectrum, but interesting features appear in the near-IR as a result of deeply penetrating light being scattered off the surface structure of the CCD.
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Summary

Improved and stable blue/UV quantum efficiency has been demonstrated on 2Kx4K imagers using molecular-beam epitaxy to create a thin doped layer on the back surface. Quantum efficiency data on thick (40-50 pm) imagers with single and dual-layer anti-reflection coatings is presented that demonstrates high and broadband response. Measurements of the...

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Broadband (200-1000 nm) back-illuminated ccd imagers

Geiger-mode avalanche photodiodes for three-dimensional imaging

January 1, 2002
  |
Journal Article
Author:
Brian F. Aull
…
Published in:
Lincoln Laboratory Journal, Vol. 13, No. 2, 2002, pp. 335-350.
Topic:
ladar
R&D area:
R&D group:

Summary

We discuss the properties of Geiger-mode avalanche photodiodes (APDs) and their use in developing an imaging laser radar (ladar). This type of photodetector gives a fast electrical pulse in response to the detection of even a single photon, allowing for sub-nsec-precision photon-flight-time measurement. We present ongoing work at Lincoln Laboratory on three-dimensional (3D) imaging with arrays of these diodes, and the integration of the arrays with fast complementary metal-oxide semiconductor (CMOS) digital timing circuits.
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Summary

We discuss the properties of Geiger-mode avalanche photodiodes (APDs) and their use in developing an imaging laser radar (ladar). This type of photodetector gives a fast electrical pulse in response to the detection of even a single photon, allowing for sub-nsec-precision photon-flight-time measurement. We present ongoing work at Lincoln Laboratory...

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Geiger-mode avalanche photodiodes for three-dimensional imaging
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