Microelectronics Laboratory

Photo of the Microelectronics Laboratory

The MIT Lincoln Laboratory Microelectronics Laboratory is the U.S. government's most capable semiconductor research and fabrication facility. This 70,000-square-foot facility has 8100 square feet of class-10 and 10,000 square feet of class-100 cleanroom areas to support a wide range of Lincoln Laboratory programs.

The 200-mm wafer equipment is continually updated and includes a production-class complementary metal oxide semiconductor (CMOS) toolset with angled ion-implantation, cluster metallization, and dry etch equipment; chemical-mechanical planarization equipment; and rapid thermal processing and advanced lithography capabilities. A molecular-beam epitaxy system is used to provide high-sensitivity and highly stable back-illuminated devices in the ultraviolet and extreme ultraviolet ranges.

Currently, staff in the Microelectronics Laboratory are developing and fabricating novel technologies, including the following:

  • A fully depleted silicon-on-insulator (FDSOI) CMOS circuit prototyping capability with extreme environment variants, including radiation hardness
  • Flight-quality gigapixel charge-coupled-device (CCD) imager focal planes and photon-counting avalanche photodiode arrays
  • Niobium-based superconducting circuits
  • Photonic integrated radio-frequency and optical microelectromechanical systems (MEMS)
  • Gallium nitride on silicon high-electron mobility transistors (GaNSi HEMTs) and circuits

Researcher in the Microelectronics Lab

In addition, the Microelectronics Laboratory supports advanced packaging with a precision multichip module (MCM) technology and an advanced three-dimensional circuit stacking technology.

More than 40 different programs from divisions at Lincoln Laboratory, as well as from industrial sponsors involved through cooperative research and development agreements, are supported by the Microelectronics Laboratory.

The Microelectronics Laboratory is staffed by approximately 60 technicians, engineers, and scientists. This facility is operated in three shifts each day, five days a week. 




The Microelectronics Laboratory supports the design, fabrication, and packaging of many novel devices. Click on the images below to get fact sheets on the innovations enabled in this lab.

FDSOI CMOS circuit wafer

Fully Depleted Silicon-on-
Insulator CMOS

Lincoln Laboratory has conducted pioneering work on fully depleted silicon-on-insulator (FDSOI) CMOS techniques. Our specialized process variants are optimized for very
low-power subthreshold operation,
high-performance mixed-signal and
RF applications, and extreme environment (cryogenic, high-temperature, and radiation) operation.

Digital focal plane array

Advanced Imaging Technology

Significant advances have been made in imaging technology for defense and scientific applications. Our imaging innovations fall broadly into three categories: charge-coupled devices, avalanche photodiodes, and digital focal plane arrays.

200-mm wafer from Si integrated photonic multiproject run

Silicon & Silicon Nitride
Integrated Photonics

Lincoln Laboratory is fabricating
silicon and silicon nitride photonic integrated circuits (PICs) on
200-mm-diameter wafers. These
PICs have demonstrated low
waveguide losses and state-of-the-art active and passive component performance.


200-mm-diameter GaN-on-Si wafer

Gallium Nitride-on-Silicon
Wafer Fabrication

Lincoln Laboratory is developing fully Si CMOS–compatible technologies for GaN high-electron-mobility transistors and circuits for RF applications. Our technology facilitates wafer-scale 3D integration of GaN with CMOS circuits to enhance functionalities with improved size, weight, and power benefits.

Photomicrograph of superconducting single-flux-quantum shift-register integrated circuit

Superconducting Integrated Circuits

The world’s most advanced single-
flux-quantum (SFQ) integrated circuit
process has been developed here at
Lincoln Laboratory. This research foundry
capability enables prototyping of advanced
SFQ circuits along with flip-chip packaging
on super conducting multi-chip modules.

Fully sealed liquid-pixel display made up of 500-um-diameter circular pixels

Optofluidic Microsystems

Lincoln Laboratory has developed processes for the design, fabrication, and demonstration of novel
optofluidic microsystems. Our
capillary-driven and electrowetting-controlled optofluidic devices find application in liquid lenses, displays, and optical shutters.

Microhydraulic actuator suspended on water

Microhydraulic Actuator Development

Our microhydraulic actuators, built with layers of thin sheets separated by structured fluids, move as the sheets slide relative to each other. This artificial muscle-like material may be used in flight control surfaces on unmanned aerial vehicles, exoskeleton systems, and artificial limbs.


The Microelectronics Laboratory has Trusted Foundry accreditation from the DMEA (Defense Microelectronics Activity) and ISO-9001 certification.  (Click on images to view full-sized documents in pdf format.)

Accreditation of Trust for MIT Lincoln Laboratory Microelectronics Scope of Microelectronics Laboratory Accreditation ISO-9001 Certificate - MIT Lincoln Laboratory Microelectronics Laboratory

Microelectronics Laboratory Management

Photo of Dan Pulver

Dan Pulver

Photo of Marc Brunelle

Marc Brunelle

Photo of Craig Hill

Craig Hill

Photo of Sal Ieni

Sal Ieni


The Microelectronics Laboratory began operations in 1994. A commemorative booklet highlights 20 important innovations that have been enabled by the facilities within this lab: 20 Innovations Over Twenty Years (pdf).

For more information about the Microelectronics Laboratory and its capabilities, contact MEL.Director@ll.mit.edu.


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