Publications

Over the past 20 years, we have developed arrays of custom-fabricated silicon and InP Geiger-mode avalanche photodiode arrays, CMOS readout circuits to digitally count or time stamp single-photon detection events, and techniques to integrate these two components to make back-illuminated solid-state image sensors for lidar, optical communications, and passive imaging...

We demonstrate a 256 x 256 passive photon counting imager based on hybridization of back-illuminated silicon Geiger-mode avalanche photodiodes to an all-digital CMOS counting chip. Photon detection efficiencies in the 10%-20% are observed at visible wavelengths. The detection efficiency is currently limited by optical crosstalk that leads to elevation of...

We report on two recently developed charge-coupled devices (CCDs) for adaptive optics wavefront sensing, both designed to provide exceptional sensitivity (low noise and high quantum efficiency) in high-frame-rate low-latency readout applications. The first imager, the CCID75, is a back-illuminated 16-port 160x160 pixel CCD that has been demonstrated to operate at...

This paper summarizes progress of a project to develop and advance the maturity of photon-counting detectors for NASA exoplanet missions. The project, funded by NASA ROSES TDEM program, uses a 256x256 pixel silicon Geiger-mode avalanche photodiode (GM-APD) array, bump-bonded to a silicon readout circuit. Each pixel independently registers the arrival...

Single-photon imaging detectors promise the ultimate in sensitivity by eliminating read noise. These devices could provide extraordinary benefits for photon-starved applications, e.g., imaging exoplanets, fast wavefront sensing, and probing the human body through transluminescence. Recent implementations are often in the form of sparse arrays that have less-than-unity fill factor. For...

We have demonstrated a wafer-scale back-illumination process for silicon Geiger-mode avalanche photodiode arrays using Molecular Beam Epitaxy (MBE) for backside passivation. Critical to this fabrication process is support of the thin ( 10 um) detector during the MBE growth by oxide-bonding to a full-thickness silicon wafer. This back-illumination process makes...

For adaptive optics systems, there is a growing demand for wavefront sensors that operate at higher frame rates and with more pixels while maintaining low readout noise. Lincoln Laboratory has been investigating Geiger·mode avalanche photodiode arrays integrated with CMOS readout circuits as a potential solution. This type of sensor counts...

We present a unique hybridization process that permits high-performance back-illuminated silicon Geiger-mode avalanche photodiodes (GM-APDs) to be bonded to custom CMOS readout integrated circuits (ROICs) - a hybridization approach that enables independent optimization of the GM-APD arrays and the ROICs. The process includes oxide bonding of silicon GM-APD arrays to...