Publications
Microwave photonic applications of slab-coupled optical waveguide devices
Summary
Summary
The semiconductor slab-coupled optical waveguide (SCOW) concept is a versatile device platform that has enabled new classes of high-power, low-noise single-frequency lasers, mode-locked lasers, optical amplifiers, and photodiodes for analog optical links and photonic analog-to-digital converters.
Temporally oblivious anomaly detection on large networks using functional peers
Summary
Summary
Previous methods of network anomaly detection have focused on defining a temporal model of what is "normal," and flagging the "abnormal" activity that does not fit into this pre-trained construct. When monitoring traffic to and from IP addresses on a large network, this problem can become computationally complex, and potentially...
Secure channel establishment in disadvantaged networks: optimizing TLS using intercepting proxies
Summary
Summary
Transport Layer Security (TLS) is a secure communication protocol that is used in many secure electronic applications. In order to establish a TLS connection, a client and server engage in a handshake, which usually involves the transmission of digital certificates. In this paper we present a practical speedup of TLS...
Physical layer considerations for wideband cognitive radio
Summary
Summary
Next generation cognitive radios will benefit from the capability of transmitting and receiving communications waveforms across many disjoint frequency channels spanning hundreds of megahertz of bandwidth. The information theoretic advantages of multi-channel operation for cognitive radio (CR), however, come at the expense of stringent linearity requirements on the analog transmit...
TALENT: dynamic platform heterogeneity for cyber survivability of mission critical applications
Summary
Summary
Despite the significant amount of effort that often goes into securing mission critical systems, many remain vulnerable to advanced, targeted cyber attacks. In this work, we design and implement TALENT (Trusted dynAmic Logical hEterogeNeity sysTem), a framework to live-migrate mission critical applications across heterogeneous platforms. TALENT enables us to change...
Low cost multifunction phased array radar concept
Summary
Summary
MIT Lincoln Laboratory and M/A-COM are jointly conducting a technology demonstration of affordable Multifunction Phased Array Radar (MPAR) technology for Next Generation air traffic control and national weather surveillance services. Aggressive cost and performance goals have been established for the system. The array architecture and its realization using custom Transmit...
Low-profile dual-polarized UHF array antenna
Summary
Summary
A low-profile dual-polarized UHF array antenna has been developed for wide field-of-view dual sector coverage in the 250 to 450 MHz frequency range for communications or radar applications. The antenna utilizes a pair of parasitically-tuned dipole arrays for horizontal polarization and a pair of parasitically-tuned monopole arrays for vertical polarization...
Ultrawideband VHF/UHF dipole array antenna
Summary
Summary
A linearly-polarized ultrawideband dipole array antenna has been developed for coverage in the VHF/UHF frequency range for communications or radar applications. The antenna design utilizes a horizontally polarized array of thick tubular dipole elements above a ground plane. Numerical electromagnetic simulations were used to analyze and optimize the antenna parameters...
Results of X-band electronically scanned array using an overlapped subarray architecture
Summary
Summary
The measured results from an X-band electronically scanned array using an overlapped subarray architecture are presented. The 2D architecture uses a 12 x 12 element subarray with 3 to 1 overlapping. The active electronic scanned array is a receive only implementation consisting of switch, low noise amplifier, phase shifter and...
SOI-enabled three-dimensional integrated-circuit technology
Summary
Summary
We have demonstrated a new 3D device interconnect approach, with direct back side via connection to a transistor in a 3D stack, resulting in a reduced 3D footprint by an estimated ~40% as well as potential for lower series resistance. We have demonstrated high yield 3D through-oxide-via (TOV) with a...