Publications
ASR-9 refractivity measurements using ground targets
Summary
Summary
Weather radars rely on the presence of radiowave scattering entities such as hydrometeors and insects to sense the dynamic evolution of the atmosphere. Under clear-air, low-reflectivity conditions, when no such "visible" tracers are present, air mass boundaries such as the outflow edge of a dry microburst may go undetected. Recently...
Contribution of photoacid generator to material roughness
Summary
Summary
The authors have developed an atomic-force-microscopy-based technique to measure intrinsic material roughness after base development. This method involves performing an interrupted development of the resist film and measuring the resulting film roughness after a certain fixed film loss. Employing this technique, the authors previously established that the photoacid generator (PAG)...
Immersion patterning down to 27 nm half pitch
Summary
Summary
Liquid immersion interference lithography at 157 nm has been used to print gratings of 27 nm half pitch with a fluorine-doped fused silica prism having index of 1.66. In order to achieve these dimensions, new immersion fluids have been designed and synthesized. These are partially fluorinated organosiloxanes with indexes up...
Required surveillance performance accuracy to support 3-mile and 5-mile separation in the National Airspace System
Summary
Summary
The Federal Aviation Administration is modernizing the Air Traffic Control system to improve flight efficiency, to increase capacity, to reduce flight delays, and to control operating costs as the demand for air travel continues to grow. Promising new surveillance technologies such as Automatic Dependent Surveillance Broadcast, (ADS-B), multisensor track fusion...
High productivity computing and usable petascale systems
Summary
Summary
High Performance Computing has seen extraordinary growth in peak performance which has been accompanied by a significant increase in the difficulty of using these systems. High Productivity Computing Systems (HPCS) seek to address this gap by producing petascale computers that are usable by a broader range of scientists and engineers...
Validating and restoring defense in depth using attack graphs
Summary
Summary
Defense in depth is a common strategy that uses layers of firewalls to protect Supervisory Control and Data Acquisition (SCADA) subnets and other critical resources on enterprise networks. A tool named NetSPA is presented that analyzes firewall rules and vulnerabilities to construct attack graphs. These show how inside and outside...
Securing communication of dynamic groups in dynamic network-centric environments
Summary
Summary
We developed a new approach and designed a practical solution for securing communication of dynamic groups in dynamic network-centric environments, such as airborne and terrestrial on-the-move networks. The solution is called Public Key Group Encryption (PKGE). In this paper, we define the problem of group encryption, motivate the need for...
SFO marine stratus forecast system documentation
Summary
Summary
San Francisco International Airport (SFO) experiences frequent low ceiling conditions during the summer season due to marine stratus clouds. Stratus in the approach zone prevents dual approaches to the airport??s closely spaced parallel runways, effectively reducing arrival capacity by half. The stratus typically behaves on a daily cycle, with dissipation...
Improving the resolution advisory reversal logic of the traffic alert and collision avoidance system
Summary
Summary
The Traffic Alert and Collision Avoidance System (TCAS II) is the worldwide standard system for manned aircraft to avoid collisions with airborne transponder-equipped traffic. A safety vulnerability of the collision avoidance logic was reported by European analysts, who also proposed a change to correct it. The safety issue concerns limitations...
A wafer-scale 3-D circuit integration technology
Summary
Summary
The rationale and development of a wafer-scale three-dimensional (3-D) integrated circuit technology are described. The essential elements of the 3-D technology are integrated circuit fabrication on silicon-on-insulator wafers, precision wafer-wafer alignment using an in-house-developed alignment system, low-temperature wafer-wafer bonding to transfer and stack active circuit layers, and interconnection of the...