Publications
Informative dialect recognition using context-dependent pronunciation modeling
Summary
Summary
We propose an informative dialect recognition system that learns phonetic transformation rules, and uses them to identify dialects. A hidden Markov model is used to align reference phones with dialect specific pronunciations to characterize when and how often substitutions, insertions, and deletions occur. Decision tree clustering is used to find...
Assessing the speaker recognition performance of naive listeners using Mechanical Turk
Summary
Summary
In this paper we attempt to quantify the ability of naive listeners to perform speaker recognition in the context of the NIST evaluation task. We describe our protocol: a series of listening experiments using large numbers of naive listeners (432) on Amazon's Mechanical Turk that attempts to measure the ability...
A time-warping framework for speech turbulence-noise component estimation during aperiodic phonation
Summary
Summary
The accurate estimation of turbulence noise affects many areas of speech processing including separate modification of the noise component, analysis of degree of speech aspiration for treating pathological voice, the automatic labeling of speech voicing, as well as speaker characterization and recognition. Previous work in the literature has provided methods...
FDSOI process technology for subthreshold-operation ultra-low power electronics
Summary
Summary
Ultralow-power electronics will expand the technological capability of handheld and wireless devices by dramatically improving battery life and portability. In addition to innovative low-power design techniques, a complementary process technology is required to enable the highest performance devices possible while maintaining extremely low power consumption. Transistors optimized for subthreshold operation...
Achieving cyber survivability in a contested environment using a cyber moving target
Summary
Summary
We describe two components for achieving cyber survivability in a contested environment: an architectural component that provides heterogeneous computing platforms and an assessment technology that complements the architectural component by analyzing the threat space and triggering reorientation based on the evolving threat level. Together, these technologies provide a cyber moving...
Thermally tuned dual 20-channel ring resonator filter bank in SOI (silicon-on-insulator)
Summary
Summary
Two 20-channel second-order optical filter banks have been fabricated. With tuning, the requirements for a wavelength multiplexed photonic AD-converter (insertion loss 1-3 dB, extinction >30 dB and optical bandwidth 22-27 GHz) are met.
Distributed multi-modal sensor system for searching a foliage-covered region
Summary
Summary
We designed and constructed a system that includes aircraft, ground vehicles, and throwable sensors to search a semiforested region that was partially covered by foliage. The system contained 4 radio-controlled (RC) trucks, 2 aircraft, and 30 SensorMotes (throwable sensors). We also investigated communications links, search strategies, and system architecture. Our...
MBE back-illuminated silicon Geiger-mode avalanche photodiodes for enhanced ultraviolet response
Summary
Summary
We have demonstrated a wafer-scale back-illumination process for silicon Geiger-mode avalanche photodiode arrays using Molecular Beam Epitaxy (MBE) for backside passivation. Critical to this fabrication process is support of the thin ( 10 um) detector during the MBE growth by oxide-bonding to a full-thickness silicon wafer. This back-illumination process makes...
Overlapped digital subarray architecture for multiple beam phased array radar
Summary
Summary
MIT Lincoln Laboratory is conducting a technology demonstration of affordable Multifunction Phased Array Radar (MPAR) technology for Next Generation air traffic control and national weather surveillance services. Aggressive cost and performance goals have been established for the system. The array architecture and its realization using custom Transmit and Receive Integrated...
Uniformity study of wafer-scale InP-to-silicon hybrid integration
Summary
Summary
In this paper we study the uniformity of up to 150 mm in diameter wafer-scale III-V epitaxial transfer to the Si-on-insulator substrate through the O2 plasma-enhanced low-temperature (300°C) direct wafer bonding. Void-free bonding is demonstrated by the scanning acoustic microscopy with sub-um resolution. The photoluminescence (PL) map shows less than...